Model/Brand/Package
Category/Description
Inventory
Price
Data
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Category: soldering stationDescription: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a roll length of 1.5 or 3m. Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes14145+$33.584950+$32.1496200+$31.3459500+$31.14491000+$30.94402500+$30.71445000+$30.57087500+$30.4273 -
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Category: soldering stationDescription: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a roll length of 1.5 or 3m. Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes48805+$29.384650+$28.1288200+$27.4256500+$27.24981000+$27.07402500+$26.87315000+$26.74757500+$26.6219 -
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Category: soldering stationDescription: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes77845+$30.081950+$28.7963200+$28.0764500+$27.89641000+$27.71652500+$27.51085000+$27.38227500+$27.2537 -
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Category: soldering stationDescription: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes35865+$34.868350+$33.3782200+$32.5438500+$32.33521000+$32.12662500+$31.88815000+$31.73917500+$31.5901 -
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Category: soldering stationDescription: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a roll length of 1.5 or 3m. Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes45545+$34.035350+$32.5808200+$31.7663500+$31.56271000+$31.35902500+$31.12635000+$30.98097500+$30.8354 -
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Category: soldering stationDescription: 9g (0.32oz) Can be easily removed using lead-free soldering flux cleaner, please refer to pen 508-63807052
